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Electroplating Technology for Electronic Connectors
日期：2019-01-24 11:23
Electronic connectors include connectors (plug-ins and sockets), connectors, connection terminals, coupler terminals, current contact shrapnel (relays), gold-plated/silver lead/patch of plug-in electronic components, patch holders of patch electronic components, electronic circuit board connectors, etc.
Advanced automatic plating production line will replace the conventional manual and semi-automatic barrel plating, hanging plating production mode. At present, the advanced plating equipments for connectors include vibration plating equipment, strip selective plating equipment and electroless plating equipment, especially strip selective plating equipment. At present, most kinds of contacts have been stamped into strips for electroplating. With the development of connector types, more and more products will be produced by using this contact. Continuous plating is suitable for terminal, connector, copper strip, copper wire, LED, semiconductor and other parts.
Electroplating Technology for Electronic Connectors
1) Continuous electroplating production line, continuous strip material stamping after forming or copper strip electroplating after stamping continuous electroplating combination production line, known as coil-to-coil electroplating abroad. Continuous electroplating is not only advanced and reliable in production technology, but also easy to realize in reducing pollution discharge. Adding compressed air sprayer to the parts in and out of plating bath at both ends of plating bath can reduce the washing water brought into the bath, reduce the loss of plating bath brought out and further become pollutants, increase the difficulty of wastewater treatment, and the cleaning process can be made into multi-stage counter-current spray washing, which is not suitable for roll-hanging plating. The technology that is too easy to implement is easy to do on continuous plating line. If a 40-meter-long double-wire continuous electroplating line is used, the total amount of wastewater discharged per day is only 20M, which is a less polluting process.
Electroplating with strip selective plating equipment can not only meet the needs of various functional parts of the contact body, but also save the consumption of precious metal materials, and also meet the needs of automatic assembly.
The plating selection modes of strip selective plating production line are immersion type, jet type with mask, drum mask mode and brush plating type with fixed head. When choosing this kind of production line, it should be decided according to the shape of the strip and the quality requirements of the functional parts of the coating. It is not necessarily necessary to prepare a fully functional production line.
2) The combination technology of continuous electroplating production line integrates high-speed electroplating technology, liquid level selective electroplating, brush plating of fixed head and mask selective electroplating technology. It can also realize the automatic control of some components of plating solution (such as additives, main salt level, etc.) and some technological parameters (temperature, pH value, etc.). The installation of ray thickness gauge can realize on-line continuous measurement of coating thickness and alloy composition. And control. It is an aggregate of a series of more advanced plating technologies, with higher production efficiency, better product quality and better consistency of performance. It can save 90-95% of precious metals compared with conventional plating technology. It is the most representative combination plating processing technology in the production of electronic connectors.
1) Selective plating technology can selectively apply coating only on the parts that need to be coated, such as contacts and welding wires. The plating area is only 5-10% of the conventional barrel plating area, and the thickness distribution is more uniform and reasonable. Especially the brush plating and mask plating of fixed head, precious metals are only plated on one side of the contacts, which has a remarkable saving effect.
2) High-speed electroplating technology, the plating part itself moves, the plating bath is forced to countercurrent with the moving direction of the plating part at a higher speed in the plating bath. Under this condition, even if ordinary plating bath is used, the current density is allowed to be more than twice as high as that of conventional plating. The running speed of continuous plating line is 1-30m/min, and the clock circulation speed is faster. With high-speed plating bath with higher concentration of main salt, the upper limit is allowed. The current density can reach three or more times that of conventional plating. Brush plating on fixed head and mask plating have very close anode and cathode distances. The plating solution renewal (circulation) speed is very fast. The current density is higher than that of conventional plating, and the plating speed is greatly improved.
Advanced automatic plating production line will replace the conventional manual and semi-automatic barrel plating, hanging plating production mode. At present, the advanced plating equipments for connectors include vibration plating equipment, strip selective plating equipment and electroless plating equipment, especially strip selective plating equipment. At present, most kinds of contacts have been stamped into strips for electroplating. With the development of connector types, more and more products will be produced by using this contact. Continuous plating is suitable for terminal, connector, copper strip, copper wire, LED, semiconductor and other parts.
Electroplating Technology for Electronic Connectors
1) Continuous electroplating production line, continuous strip material stamping after forming or copper strip electroplating after stamping continuous electroplating combination production line, known as coil-to-coil electroplating abroad. Continuous electroplating is not only advanced and reliable in production technology, but also easy to realize in reducing pollution discharge. Adding compressed air sprayer to the parts in and out of plating bath at both ends of plating bath can reduce the washing water brought into the bath, reduce the loss of plating bath brought out and further become pollutants, increase the difficulty of wastewater treatment, and the cleaning process can be made into multi-stage counter-current spray washing, which is not suitable for roll-hanging plating. The technology that is too easy to implement is easy to do on continuous plating line. If a 40-meter-long double-wire continuous electroplating line is used, the total amount of wastewater discharged per day is only 20M, which is a less polluting process.
Electroplating with strip selective plating equipment can not only meet the needs of various functional parts of the contact body, but also save the consumption of precious metal materials, and also meet the needs of automatic assembly.
The plating selection modes of strip selective plating production line are immersion type, jet type with mask, drum mask mode and brush plating type with fixed head. When choosing this kind of production line, it should be decided according to the shape of the strip and the quality requirements of the functional parts of the coating. It is not necessarily necessary to prepare a fully functional production line.
2) The combination technology of continuous electroplating production line integrates high-speed electroplating technology, liquid level selective electroplating, brush plating of fixed head and mask selective electroplating technology. It can also realize the automatic control of some components of plating solution (such as additives, main salt level, etc.) and some technological parameters (temperature, pH value, etc.). The installation of ray thickness gauge can realize on-line continuous measurement of coating thickness and alloy composition. And control. It is an aggregate of a series of more advanced plating technologies, with higher production efficiency, better product quality and better consistency of performance. It can save 90-95% of precious metals compared with conventional plating technology. It is the most representative combination plating processing technology in the production of electronic connectors.
1) Selective plating technology can selectively apply coating only on the parts that need to be coated, such as contacts and welding wires. The plating area is only 5-10% of the conventional barrel plating area, and the thickness distribution is more uniform and reasonable. Especially the brush plating and mask plating of fixed head, precious metals are only plated on one side of the contacts, which has a remarkable saving effect.
2) High-speed electroplating technology, the plating part itself moves, the plating bath is forced to countercurrent with the moving direction of the plating part at a higher speed in the plating bath. Under this condition, even if ordinary plating bath is used, the current density is allowed to be more than twice as high as that of conventional plating. The running speed of continuous plating line is 1-30m/min, and the clock circulation speed is faster. With high-speed plating bath with higher concentration of main salt, the upper limit is allowed. The current density can reach three or more times that of conventional plating. Brush plating on fixed head and mask plating have very close anode and cathode distances. The plating solution renewal (circulation) speed is very fast. The current density is higher than that of conventional plating, and the plating speed is greatly improved.
